FOPLP vs. CoPoS: Two rising formats in panel-level chip packaging

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic about the potential of Panel Level Packaging (PLP) to take the baton. With its inherent advantages, such as transforming substrates from round to square, PLP is positioned to become the new mainstream technology for AI chip packaging.

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Taiwan microLED suppliers gear up as global panel makers begin mass production

Taiwan’s microLED equipment manufacturers are positioning for explosive growth as major panel makers worldwide begin constructing production capacity for mass manufacturing. PlayNitride expects to double its equipment sales by 2025, while firms like Kjet and Microloops are advancing through verification processes with leading panel manufacturers or initiating shipments.

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