Adlink Technology will actively integrate resources with strategic partners and focus future development efforts on the fields of edge AI, edge visualization, robot and autonomous driving solutions, according to Jim Liu, chairman of the Taiwan-based industrial PC (IPC) vendor.

Advanced packaging technology has become a powerful tool for TSMC to grab orders for advanced chips. Now Samsung Electronics has also announced that it will strengthen its back-end packaging and testing technology. As for the top 10 makers in the packaging and testing industry, their revenue in 2021 reached US$33.7 billion. And the top-10 accounted for about 90% of the global packaging and testing industry, so the size of this market was about US$37 billion. Including back-end production of TSMC, Samsung, Intel and even Rohm, the output value of the whole industry wuld be about US$39.7 billion.

The Indian government is formulating a single standard specification for swappable EV batteries, and companies have expressed their fears about a battery monopoly that kills innovation.