21
May
据环球时报,印度《经济时报》报道,印度政府公布的最新数据显示,过去3年,印度智能手机对美国出口增长近5倍,对日本出口增长约4倍,超过石油和钻石等传统产品,成为该国最大的出口商品。
21
May
小米、高通签署全新多年协议
5月20日,高通技术公司和小米集团庆祝双方长达15年的合作,并宣布签署全新多年合作协议。在协议期内,小米的旗舰智能手机产品将持续搭载骁龙8系移动平台,覆盖多个产品代际,并将在中国及全球市场销售。
21
May
换屏14879元!华为MateBook Fold非凡大师维修价格公布
5月21日消息,华为19日发布全球首款鸿蒙折叠电脑华为MateBook Fold非凡大师,起售价23999元,采用华为史上最好的屏幕,维修更换贵不贵?该机维修备件价格已在华为官网公布。
21
May
龙腾光电:越南生产基地预计三季度量产
在5月19日的2024年及2025年一季度业绩会上,龙腾光电表示,越南生产基地已成功点亮产品,预计今年三季度实现量产。
21
May
谷歌Xreal Project Aura智能眼镜发布
5月21日消息,在今年的谷歌I/O大会上,Xreal发布了Project Aura,这是搭载Android XR平台的第二款官方设备。产品正式上市发售时间,预计最快为今年下半年。
21
May
Zeiss joins AI server race at Computex 2025
Zeiss made its debut at Computex 2025, unveiling industrial metrology tools designed for AI server manufacturing, including CT scanners, 3D scanning systems, and industrial microscopes. Marc Wawerla, CEO of Zeiss Industrial Quality Solutions (IQS) and President & CEO of Carl Zeiss Industrielle Messtechnik GmbH, said the company aims to help supply chain partners set new quality standards for next-gen server production.
21
May
Japan’s chip buildout stalls as new fabs sit idle
Of the seven semiconductor fabs completed in Japan during fiscal 2023–2024 (April 2023 to March 2025), only three had begun mass production by April 2025. New facilities from Kioxia, Renesas Electronics, Rohm Semiconductor, and Sanken Electric remain inactive, while Sony has launched production but is moving forward conservatively.
21
May
Hushan Autoparts hits record highs in 1Q25 revenue
Hushan Autoparts posted NT$423 million (US$14 million) in consolidated revenue for the first quarter of 2025, marking a new record high in quarterly revenue for the company. The 47% year-over-year surge came primarily from renewed demand for global aftermarket parts and continued deliveries of new product lines. Moreover, first-quarter operating net profit grew by 72% year-over-year, while net profit after tax reached NT$120 million (US$4 million), signaling stellar results for the quarter if the impact of exchange rate fluctuations is excluded.
21
May
TÜV Rheinland highlights compliance challenges in the age of intelligent vehicles
As smart vehicles shift from mechanical machines to software-defined platforms, the global auto industry is confronting structural challenges that stretch far beyond hardware. At the Smart Automotive Forum held on May 16 in Taipei, TÜV Rheinland, a leading global provider of technical testing and certification, presented a comprehensive white paper titled Driving the Future: Key Trends in Intelligent Vehicle Development (transliteration), which outlines the regulatory, technical, and validation transformations ahead.
21
May
Getac and AI server makers stay strong despite tariff pressures
As the global electronics industry braces for the disruptive effects of renewed tariff tensions under the Trump administration’s trade policy revival, two sectors appear to be emerging largely unscathed: military-grade rugged computing and AI servers.