TSMC tightens restrictions on Chinese IC firms in line with US semiconductor controls

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design firms amid intensifying US-China trade tensions. Effective January 31, 2025, products using 16/14nm and below technologies must be packaged by a US Bureau of Industry and Security (BIS)-certified third-party OSAT (Outsourced Semiconductor Assembly and Test) provider. Furthermore, TSMC requires an official certification copy from the approved packaging firm before proceeding with shipments, with deliveries halted if documentation is not provided.

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Ezconn rides AI data center boom with record growth, eyes 2025 expansion

Ezconn anticipates another year of strong growth in 2024, driven by robust demand from the US AI data center sector. Orders have increased significantly ahead of anticipated tariffs, pushing January revenue to historic levels despite the Lunar New Year holidays. The company expects its first-quarter performance to exceed projections, with shipments of high-core-count fiber optic products set to maintain momentum through 2025.

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Jarllytech’s revenue declines in January 2025 amid Lunar New Year labor shortage

Jarllytech, a bearing manufacturer, reported that its January 2025 production capacity was significantly affected by labor shortages in its mobile phone bearing assembly lines during the Lunar New Year holiday, resulting in a notable revenue decline. However, analysts expect demand to remain strong, citing the ongoing peak shipment period for foldable devices to Chinese customers and anticipated robust orders.

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