TSMC is fast-tracking its capacity expansion with plans to build nine new facilities in 2025, including eight wafer fabs and one advanced packaging plant. The move has energized sentiment across its supply chain. Advanced Echem Materials Company (AEMC) Chairman Chan Wen-hsiung said the firm had already anticipated this expansion, citing new capacity at its Tainan and Kaohsiung facilities as sufficient to support customer needs through 2030. A US plant is not under consideration before then and would only be evaluated after that timeline.

In a keynote on May 19, 2025, Nvidia CEO Jensen Huang focused on AI infrastructure, AI agents, and physical AI (robots). He highlighted that AI agents require significantly more computing power than one-shot AI. While cloud providers have launched AI agent services, the key challenge for widespread adoption is achieving cross-system integration and standardization.

Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing the capabilities of high-speed data transmission critical to artificial intelligence (AI) infrastructure. The new solution doubles the transmission speed to 200 Gbps per lane, while dramatically improving energy efficiency and cost.

At this year’s COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company’s proprietary NVLink interconnect to third-party ASICs and CPUs. Huang underscored his goal of “doing business with every customer.” Notably absent from the list of launch partners was ASIC and networking chip powerhouse Broadcom.