总投资35亿元，江苏一Mini LED项目即将封顶！
据“靖江发布”，目前，永盛光电Mini LED显示背光源、屏体及铝镁合金压铸件产业化项目正在全速推进建设。一期项目主厂房即将封顶，正在进行墙体砌筑，二期项目正在进行桩基工程。
04
Aug
04
Aug
群创人事洗牌！新组织8月上路
8月4日消息，群创新组织8月上路！群创推动BG（Business Group）事业群化，内部公告原南科、竹科制造中心整并至「行动智慧方案事业群」和「大尺寸智能方案事业群」，分别由协理陈鹊如和副总经理潘泰吉负责。另外非显示器事业中心则是成立「群超事业中心」，由顾问王志超主掌。
04
Aug
三安光电拟联合境外投资人收购知名LED企业Lumileds
8月2日，三安光电披露，公司拟联合境外投资人Inari收购Lumileds Holding B.V.100%股权。本次交易中，标的资产以“零现金零负债”为计算基础，企业价值为2.39亿美元，最终收购价款将根据最终交割日财务报表中的数据和《股份购买协议》的相关约定确定。
04
Aug
晶合集成筹划赴港IPO
8月1日晚间，晶合集成(688249)披露，为深化公司国际化战略布局，加快海外业务发展，进一步提高公司综合竞争力及国际品牌形象，同时充分借助国际资本市场的资源与机制优势，优化资本结构，拓宽多元融资渠道，公司正在筹划发行境外上市股份（H股）并在香港联交所上市。
04
Aug
三星Galaxy Z Fold 7在美销量超前代50%
8月4日消息，据彭博社报道，当地时间上周四，三星电子称美国消费者对其最新款高端折叠手机的反应热烈，销量较上一代提升了50%。
03
Aug
CHPT resumes new plant project amid growing AI chip test demand
Chunghwa Precision Test Tech (CHPT), a leading provider of semiconductor test interface products, has resumed a capacity expansion project to build a new plant in Taiwan, catering to strong demand from the AI sector.
03
Aug
US defense contractors deepen Taiwan ties as AI military applications expand
American defense technology companies are strengthening relationships with Taiwan’s tech sector as the Biden administration’s AI action plan signals increased military AI spending, potentially boosting demand for dual-use hardware and cybersecurity systems.
03
Aug
Ex-Cambricon chip architect takes major step at new venture with major angel backing
Former Cambricon Technologies CTO Liang Jun has taken a significant leap with his new venture. On July 30, Shanghai Fangqing Technology — where Liang now serves as CEO — announced it had raised several hundred million Chinese yuan in angel funding. The round was supported by top-tier backers, including the Strategic Investment Division of Xiaomi, Nio Capital, and Shanghai Lingang Holdings.
03
Aug
No need to reinvent the wheel: Taiwan pushes to standardize AI robots like PCs
Amid surging global demand for AI-driven robotics, Taiwan’s industry leaders are banding together to form strategic alliances aimed at capturing new opportunities, but success won’t come easy. Key challenges include the lack of standardized platforms and critical components, as well as unresolved issues around regulations, certification, and safety testing. While the move has been broadly welcomed, concerns persist over the execution gap between ambition and real-world complexity.
03
Aug
Tong Hsing bets on 800G and GaN to offset currency-driven profit slide
Tong Hsing Electronics, a key player in the backend packaging and testing of CMOS image sensors (CIS), held its quarterly investor conference on July 29, 2025. The company warned that a recent sharp appreciation of the New Taiwan dollar has resulted in foreign exchange losses. As a result, third quarter 2025 revenue is expected to dip slightly compared to the second quarter.