TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations, underscoring sustained demand for AI and high-performance computing (HPC) chips.
A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations in calling for the European Commission to impose interim measures while it processes an antitrust case against Broadcom. The case concerns recent licensing changes made by the chip designer on the virtualization platform VMware.
Beijing Approach AI Technology Co., or Approaching.AI, raised more than CNY1 billion within six months by selling AI tokens generated largely on computing infrastructure it does not own.
South Korean President Lee Jae-myung unveiled the country’s Three Mega Projects for AI and Semiconductors in late June 2026, an ambitious national strategy designed to strengthen South Korea’s global leadership in artificial intelligence and semiconductors. The initiative centers on three pillars—semiconductors, physical AI, and AI data centers—and aims to double the nation’s DRAM output within five years while expanding capabilities in high-bandwidth memory (HBM), advanced packaging, AI processors, and next-generation memory technologies. It also seeks to extend South Korea’s semiconductor footprint beyond the Seoul metropolitan region.
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