Samsung Electronics is accelerating efforts to improve yields for its sixth-generation high bandwidth memory (HBM4), as it seeks to narrow the gap with market leader SK hynix. According to Chosun Biz, yields for Samsung’s latest 10nm-class 1c DRAM have surpassed the industry’s “mature yield” threshold of around 80%, indicating meaningful progress at the wafer level.

Fresh off a quarter in which it beat its own margin forecasts by a wide margin, TSMC issued second-quarter guidance that signals the AI-driven chip boom is accelerating rather than plateauing. The world’s largest contract chipmaker projected a second quarter 2026 revenue of US$39-40.2 billion, which at the midpoint would represent roughly 9% sequential growth from the US$35.90 billion it just reported — and more than 50% above where it stood a year ago.

Rising upstream component costs and higher new-phone prices are expected to slow global smartphone shipments in 2026, fueling stronger demand for used devices internationally and prompting companies to bolster secondhand operations; at the same time, uncertainty from the US‑Iran conflict threatens shipping routes and could disrupt supply flows through Dubai.

Cadence Design Systems and Nvidia have expanded their partnership to accelerate the use of artificial intelligence (AI) across semiconductor design, robotics, and large-scale AI infrastructure, the companies said at CadenceLIVE Silicon Valley 2026. The collaboration aims to combine Cadence’s electronic design automation (EDA) software with Nvidia’s accelerated computing and AI platforms to improve engineering productivity and reduce development cycles.