China smartphone AP shipments, 1Q 2025
Smartphone AP shipments for Chinese brands are expected to rise 8.7% on year in the second quarter of 2025 as the brands are preparing inventory for the third quarter.
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May
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May
Intel focuses automotive efforts on China with Auto Shanghai debut
Ever since Intel launched its automotive efforts in a high-profile announcement in early 2024, with its automotive business headquartered in China, the chipmaker’s ambitions for this segment have remained just as strong after current CEO Lip-bu Tan took the helm in March 2025.
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May
LG Display pioneers blue phosphorescent OLED, achieves world-first product validation
LG Display (LGD) has become the first company worldwide to achieve product validation for a blue phosphorescent OLED panel, advancing a long-elusive milestone in the development of the so-called “dream OLED.”
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May
Huawei reportedly erects three advanced chip fabs in Shenzhen to sidestep foreign tech
Facing escalating US sanctions and export bans, Huawei is reportedly building three semiconductor fabs in Shenzhen’s Guanlan district to localize its supply chain for advanced AI chips. The facilities are expected to anchor Huawei’s in-house production of Kirin smartphone processors and Ascend AI accelerators.
05
May
Taiwan’s tech leader urged investment in power infrastructure for AI era
As AI reshapes global industries and geopolitical dynamics, Taiwan’s business leaders are sounding the alarm on a critical yet often overlooked piece of the equation: power.
05
May
iPhone sales in China falter: headwinds on four fronts
Apple reported iPhone sales revenue of US$46.8 billion for the first quarter of 2025, representing a 1.9% increase compared to the same period last year, according to its financial results for the second quarter of fiscal 2025 (2Q25, covering January to March), released on May 2. However, growing market concerns indicate a potential continuous slowdown in iPhone sales in China, which could significantly impact Apple’s overall operational performance.
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May
PC pioneer FICG retools for the AI age with optical module surge
Once Taiwan’s second-largest PC maker, First International Computer (FIC), has reinvented itself as a top-three global supplier of optical modules. Leo Chien, Chairman of parent firm FIC Global, Inc. (FICG), said the company plans to double its optical communications capacity within three years by expanding a new facility in Malaysia. “Customer orders suggest the AI boom is absolutely insane,” Chien told DIGITIMES.
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May
Semco to start mass production of AI-use ABF substrates and trial production of glass substrates in 2Q25
Samsung Electro-Mechanics (Semco) is set to expand its advanced IC substrate business by officially ramping up mass production of IC substrates for artificial intelligence (AI) accelerators starting in the second quarter of 2025. The company will also initiate trial production of glass core substrates (GCS).
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May
MediaTek’s AI chip blitz catapults ASE to a year’s worth of packaging tool orders in one quarter
Amid escalating global trade tensions, Taiwan-based chip designer MediaTek is ramping up efforts around its next-generation flagship smartphone SoCs and Arm-based PC and notebook processors, driving unprecedented demand for outsourced semiconductor assembly and test (OSAT) services.
05
May
Barcelona rises as Europe’s strategic tech investment nexus as US-China rift widens
While the Czech Republic is often seen in Taiwan as Europe’s semiconductor hotspot, Spain receives the most EU funding for tech initiatives. In early 2025, the DIGITIMES team visited Barcelona to cover MWC 2025 and explore the region’s fast-evolving innovation ecosystem.