Foxconn is broadening its third-party environmental, social, and governance audit program to nine facilities across China, Vietnam, Malaysia, India, and Mexico in 2024, as the iPhone assembler strengthens its sustainability efforts globally.

Towa, a prominent name in Japan’s semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company revealed a strategic three-year midterm plan set to culminate in March 2028. The aim is to expand its sales channels throughout Asia for its leading equipment. Towa forecasts a 31% increase in consolidated revenue from March 2025 figures, expecting it to reach JPY71 billion (US$473.97 million), while net profit is projected to rise by 39% to JPY10.9 billion.

Taiwan’s electronics component industry has benefited from strong demand driven by AI and high-performance computing applications, with recent export, production, and outbound orders showing double-digit year-over-year growth. The expansion of AI server production also bodes well for the industry’s prospects. However, Taiwan’s shipping industry has raised concerns, citing the tariff policies announced by Trump on April 2, which have introduced uncertainty into the economic outlook, with the risk of economic downturn increasing significantly in 2025.