SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand

SK Hynix announced during its 77th shareholders’ meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak stated that customer negotiations for 2026 HBM product allocations will conclude by mid-2025 to enhance sales stability, according to South Korean media reports, including JoongAng Ilbo and Hangkyung.

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AI Expo 2025: Trend Micro warns of AI security risks, highlights ‘grandma prompt’ threat

At the AI Expo hosted by DIGITIMES, Trend Micro’s general manager for Taiwan and Hong Kong, Bob Hung, has identified prompt injection as a growing cybersecurity risk associated with large language models (LLMs). He also warned that users are increasingly manipulating AI through sentimental narratives and role-playing techniques, such as the “grandma prompt,” to bypass content restrictions and generate prohibited material.

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Risk-taking backfires: How Intel’s missteps paved the way for TSMC’s supremacy

Former TSMC co-CEO Shang-yi Chiang and renowned immersion lithography expert Burn Lin have weighed in on TSMC’s dominance in the global semiconductor market. Chiang noted that competitors have repeatedly faltered over the years, enabling TSMC to secure over 60% of the foundry services market, which he attributed not to extraordinary achievements but competitors’ missteps.

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Chinese expansion floods global UV curing materials market

Chinese manufacturers continue expanding production capacity for UV curing materials, creating market oversupply and triggering intense price competition across global markets. Despite these short-term challenges, industry leaders Eternal Materials and Qualipoly Chemical (QPC) remain optimistic about long-term prospects, citing the technology’s energy efficiency and environmental advantages.

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