Intel’s reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington’s support to revive its foundry business.

Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026. Taiwanese package substrate makers confirmed they have received the official notice, as cost pressure in the IC substrate supply chain remains elevated.

As AI server orders surge, system assembly makers are finding that more business does not always mean better profits. High-priced GPUs and soaring memory costs are pushing up revenue without lifting manufacturing fees at the same pace, leaving original design manufacturers (ODMs) facing lower gross margins as assembly orders grow.

L&T Semiconductor Technologies’ multiyear agreement with Synopsys to use AI-enabled multiphysics simulation software could accelerate the development of power modules and intelligent power modules, potentially affecting global electric mobility, renewable energy, and industrial automation by improving design efficiency, reliability, and time-to-market for next-generation power electronics, and by enhancing supply-chain resilience.