The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a next-gen memory standard featuring major architectural and interface upgrades for dramatically improved bandwidth, capacity, and power efficiency.

Ennostar, a leading developer in compound semiconductors, showcased major advancements in Micro LED technology at Touch Taiwan 2025, with a dual focus on innovation at both the component and application levels. The centerpiece of its exhibition included a cutting-edge GemiLED platform and a transparent 30-inch automotive display now ready for mass production.

China’s RF chip sector is facing a major disruption as Murata Manufacturing files five patent lawsuits against Maxscend Technologies in both China and South Korea, alleging that its MAX-SAW filters—commonly referred to as TF-SAW—violate five core Murata patents. Patent analysis indicates a broader risk, with nearly all TF-SAW-based products from Maxscend potentially exposed to systemic infringement claims.