On April 1, 2025, TSMC’s Japanese subsidiary, JASM, hosted its annual new employee enrollment ceremony, a tradition for many Japanese companies, at its headquarters in Kikuyo Town, Kumamoto Prefecture, Kyushu. Despite delays in the installation of some equipment at JASM’s first wafer plant and a postponed construction schedule for the second plant, the company saw a significant increase in the number of new hires this year.

Foxconn is broadening its third-party environmental, social, and governance audit program to nine facilities across China, Vietnam, Malaysia, India, and Mexico in 2024, as the iPhone assembler strengthens its sustainability efforts globally.

Towa, a prominent name in Japan’s semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company revealed a strategic three-year midterm plan set to culminate in March 2028. The aim is to expand its sales channels throughout Asia for its leading equipment. Towa forecasts a 31% increase in consolidated revenue from March 2025 figures, expecting it to reach JPY71 billion (US$473.97 million), while net profit is projected to rise by 39% to JPY10.9 billion.