In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage capacity and technologies, and its manufacturing process completely diverged from that of DRAM. The synergy of utilizing the same processes and equipment for the two memory types – DRAM and NAND – was completely gone, and the core of competitive strategies in the memory industry changed.

Overall notebook production in China, which mainly takes place in major coastal cities in eastern China, is unlikely to return to pre-lockdown levels until July, according to industry sources. Insufficient manpower and logistical problems were cited as the main challenges.

Despite recent falls in memory chip prices, Winbond Electronics is poised to generate sequential revenue growth in the second quarter of 2022, according to market sources.