Memory module maker Goldkey Technology officially received approval from the Taiwan Stock Exchange on June 5, 2025, for its initial public offering (IPO), with a listing capital of NT$680 million (US$22.71 million). The company is well-positioned to capitalize on the recovery of the global memory industry in 2025 and anticipates significant growth momentum in the second half of the year.

6月6日消息，科技媒体ytechb昨日（5日）发布博文，分享了荣耀X6c手机的高清渲染图以及详细规格配置。

6月4日晚，飞凯材料宣布拟对参股子公司苏州爱科隆材料有限公司（以下简称“爱科隆”）增资扩股。

6月6日消息，据韩媒，三星计划推出首款价格更为亲民的折叠屏手机Galaxy Z Flip FE，仅提供128GB和256GB两种存储配置。