消息称三星Galaxy S25 Edge手机销售低于预期
6月4日消息，据外媒SamMobile报道，三星寄希望于Galaxy S25 Edge能够为低迷的手机市场注入新的活力，并为公司乃至整个行业开辟新的收入来源。然而，这款备受瞩目的超薄新机似乎并未能完全实现三星的宏伟愿景，甚至可能从一个美好的梦想沦为一场噩梦。
04
Jun
04
Jun
华映科技：全资子公司开展3.5亿元融资租赁业务
6月2日，华映科技（000536）公告，全资控股子公司福建华佳彩有限公司与芯鑫融资租赁（厦门）有限责任公司开展3.5亿元融资租赁业务，租赁期3年。
04
Jun
将迎来史上最轻大折叠屏手机？vivo X Fold5预计本月发布！
6月4日消息，vivo产品经理韩伯啸3日表示，vivo X Fold5预计在本月正式发布，这款手机或将成为史上最轻的大折叠屏手机，刷新大折叠屏手机的轻量化纪录。
04
Jun
04
Jun
王东升带队，奕斯伟赴港IPO
5月30日，北京奕斯伟计算技术股份有限公司（以下简称“奕斯伟计算”）正式向港交所递交招股书。这是半年内，董事长王东升带队冲刺的第二个IPO。早在2024年11月29日，西安奕斯伟材料的科创板IPO就已经获正式受理。
04
Jun
瑞联新材：股东拟减持不超3.33%公司股份
瑞联新材(688550)6月3日晚间公告，股东宁波国富永钰创业投资合伙企业（有限合伙）（以下简称“国富永钰”）持有公司8.31%股份，计划以集中竞价或大宗交易的方式进行减持，预计减持股份不超过573.11万股，占公司总股本的3.33%。
04
Jun
Six advisors behind Trump’s unpredictable tariff agenda
As global trade tensions resurface, Wall Street insiders have coined a new acronym — TACO (Trump Always Chickens Out) — to mock President Donald Trump’s unpredictable tariff strategies, according to reports from CNN and the BBC. The label has struck a nerve with Trump, who views it as a direct challenge to his self-image as a tough, uncompromising negotiator.
04
Jun
ASE bets on new chip tech to handle AI’s rising power and speed needs
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial intelligence (AI) and high-performance computing (HPC) applications. The advanced fan-out chip-on-substrate (FOCoS) solution significantly reduces chip energy loss to one-third of current levels, providing a leap in energy efficiency and performance.
04
Jun
Coretronic intelligent robotics launches Jupiter AI+ to transform sensors into smart nodes
MEMS Coretronic, a subsidiary of Coretronic Corporation, has unveiled its latest innovation—the “Jupiter AI+ solution”—which integrates artificial intelligence directly into sensor endpoints. This advancement turns conventional sensors into intelligent nodes capable of real-time data analysis, aiming to enhance operational efficiency and reduce equipment downtime across industrial environments.
04
Jun
Samsung and Intel take foundry fight into each other’s backyard
Samsung Electronics and Intel are taking their semiconductor foundry competition directly to each other’s home turf in June, as both companies seek to narrow the gap with market leader TSMC.