Amid the growing trend toward connected, autonomous, shared, and electrification (CASE) in the automotive industry, vehicles are now much more than simply mechanical products but rather rely on contributions spanning the ICT, software, semiconductor, and optical sectors.
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM’s advanced packaging plant in Bromont, Quebec. Under the deal, IBM will establish a high-volume manufacturing line centered on Deca’s fan-out interposer technology, known as MFIT.