SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand

SK Hynix announced during its 77th shareholders’ meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak stated that customer negotiations for 2026 HBM product allocations will conclude by mid-2025 to enhance sales stability, according to South Korean media reports, including JoongAng Ilbo and Hangkyung.

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Taiwan’s economic outlook shows positive momentum in February 2025

On March 27, the National Development Council (NDC) of Taiwan released its economic outlook for February 2025, revealing a positive momentum in the country’s economic activities, fueled by global investments in technology sectors. The report highlighted a substantial increase in capex by global tech giants in artificial intelligence (AI) and data centers, while Taiwan’s strategic position in the semiconductor supply chain continues to bolster its export capabilities.

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Chinese expansion floods global UV curing materials market

Chinese manufacturers continue expanding production capacity for UV curing materials, creating market oversupply and triggering intense price competition across global markets. Despite these short-term challenges, industry leaders Eternal Materials and Qualipoly Chemical (QPC) remain optimistic about long-term prospects, citing the technology’s energy efficiency and environmental advantages.

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