18
Feb
With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company’s fifth factory in Penang, Malaysia, officially opened on February 18, 2025.
18
Feb
Infineon ships first 8-inch SiC product to customers
According to Infineon’s press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released its first products in the first quarter of 2025. These products, produced in Villach, Austria, will offer premium SiC power solutions for high-voltage applications such as renewable energy systems, trains, and electric vehicles.
18
Feb
Hu Shan Autoparts advances AM 2.0 strategy, eyes growth in North America
As the world’s largest aftermarket (AM) car door handle manufacturer, Taiwan-based Hu Shan Autoparts has been actively advancing its “AM 2.0” product strategy in recent years. This initiative targets the mid-to-high-price market by offering premium upgraded components, aiming to enhance both quality and profitability.
18
Feb
DRAM manufacturers reportedly plan to cease DDR3, DDR4 production by late 2025
The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and Micron to adjust their strategies. These companies are pivoting toward DDR5 and high-bandwidth memory (HBM) and may phase out DDR3 and DDR4 by 2025, anticipating a future focused on advanced memory technologies.
18
Feb
Former TSMC chairman Mark Liu launches new think tank to bolster US tech competitiveness
Mark Liu, the former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), is spearheading a bold initiative to enhance American technology leadership. According to a statement released by the University of California, Berkeley (UC Berkeley), Liu is establishing the Technology Competitiveness and Industrial Policy Center (TCIP) at the university, aiming to usher in a new era of advanced technology development and domestic production.
18
Feb
Trump’s off-the-cuff comments stoke global tensions, Taiwan moves to secure high-tech sector
US President Donald Trump has increasingly engaged with the media in unscripted exchanges, often deflecting criticism by blaming former administrations, including those of Joe Biden and Barack Obama. His off-the-cuff remarks, which frequently mirror the combative tone of his campaign rhetoric, have raised concerns worldwide. In Taiwan, Trump’s latest statements triggered the country’s first National Security Council meeting of 2025—not in response to Chinese military maneuvers, but due to the potential economic and geopolitical fallout of his remarks.
18
Feb
‘Giant screen storm’ hits TV market, bringing end to panel production cuts
A ‘giant screen storm’ is currently underway as a result of the market’s surge in ultra-large TVs, which will greatly contribute to the reduction in production capacity. If this trend continues, the panel industry expects to achieve supply-demand equilibrium in 2029 without having to curtail production, according to industry sources.
18
Feb
Win Semiconductors targets SiPh CPO, expecting to increase share in optical communications
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes, growth in optical communications and Wi-Fi 7 is expected to drive a rebound, positioning the company for a stronger market presence.
18
Feb
Acer’s 10% price hike: Assessing fallout of US tariffs on American firms and Asia
Acer CEO Jason Chen confirmed in a UK interview that the company will raise prices on US-bound laptops made in China by 10% next month in response to Trump’s tariffs. He also hinted at possible production shifts beyond China, including manufacturing in the US, The Telegraph reported.
18
Feb
ASE to increase spending in 2025 for expansion, new Malaysia plant reportedly set to open
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for expanding advanced packaging and testing capacities. Notably, ASE’s new plant in Malaysia is set to officially commence operations soon, which is expected to further contribute to revenue growth in its packaging and testing business.