Intel chip fabrication pant selling US$3.85 billion of bonds
A company tied to Intel Corp.’s expansion of computer chip factories in Arizona is selling $3.85 billion of investment-grade bonds on Thursday.
03
May
03
May
Apple’s surprise iPhone China growth leaves lingering questions
Apple Inc. surprised investors with a decent beat on quarterly revenue from China, countering months of data that showed a quickening decline in iPhone sales.
03
May
Global server market, 1Q 2024
Global server shipments slid slightly from a quarter ago in the first quarter of 2024 and will rise around 2% both sequentially and on-yearly in the second quarter.
03
May
What made AMD give a conservative projection for its 2024 outlook?
AMD challenges Nvidia’s dominance in the AI market with its Instinct MI300 accelerator which has been well-received by the market. However, since Nvidia’s next-generation Blackwell platform is priced lower than expected, how would that impact AMD?
03
May
Meta struggled to monetize AI products in near term
Meta regained market focus with the widespread popularity of its open Llama. Nevertheless, as its AI investments are still in the early stages, it will take years to see returns.
03
May
Microsoft CEO wraps up Southeast Asia tour, pledging billions into AI talent boost and establishment of data centers
Microsoft CEO Satya Nadella’s tour across Southeast Asia has concluded, having visited three key countries: Indonesia, Thailand, and Malaysia, as part of the company’s strategic outreach efforts in the region.
03
May
Taiwan weighs hydrogen future amid renewable energy hurdles
Hydrogen is a critical decarbonization vector and can connect and reshape current power, gas, chemicals, and fuel markets.
03
May
TSMC dominates global foundry market with 61% market share in 4Q23, says Counterpoint
Counterpoint released the global foundry market share ranking for the fourth quarter of 2023, showing that TSMC maintained its leadership status with a 61% market share driven by strong demand from AI and the restocking of smartphones.
03
May
SK Hynix’s 12-layer HBM to hit market earlier than expected
SK Hynix recently held a press conference to unveil its development blueprint for HBM4, scheduled for mass production in 2025, a year ahead of the original plan, to maintain its technological leadership in the High-Bandwidth Memory (HBM) market.
03
May
Pegatron latest company to venture into Traditional Chinese AI LLMs; partners up with NTU team
Following in the footsteps of MediaTek, Pegatron is also starting to use open-source models to build a Traditional Chinese LLM, with partners including Nvidia and other industry representatives. It is reported that the team that developed the Taiwan LLM, which is from the Department of Computer Science and Information Engineering (CSIE) at National Taiwan University (NTU), is also a partner.