Taiwan’s National Science and Technology Council (NSTC) has designated the silicon photonics (SiPh) co-packaged optics (CPO)-AI ecosystem as a core focus for the next decade, aiming to advance key AI computing infrastructure and technologies. This move aligns with the government’s new AI-driven initiatives under the “New Ten Major AI Construction Projects,” which include unmanned vehicles, smart robots, SiPh, and quantum technology development. The NSTC’s decision comes amid a stalled 2026 budget proposal totaling NT$299.2 billion (US$9.5 billion), which includes funding for these critical tech sectors. If the 2026 plan is interrupted, continuation will depend on securing support beyond 2027 to maintain momentum in this strategic area.

Materials test and analysis provider MSScorps continued its record-breaking revenue performance in December 2025, buoyed by active investments by customers in advanced processes and next-generation advanced packaging technologies. Robust demand from semiconductor and artificial intelligence (AI) customers fueled orders for materials analysis, as well as silicon photonics (SiPh) and AI inspection and testing services.

China’s domestic lithography sector is entering another phase of internal restructuring, with AMIES Technology consolidating industrial assets originally spun out from Shanghai Micro Electronics Equipment (Group) Co., Ltd. (SMEE). Corporate filings and Shanghai Securities News show that AMIES has acquired 100% of Shanghai Weiyao Industrial Co. for CNY228.5 million (US$32.5 million), replacing SMEE as the sole shareholder. The transaction completes SMEE’s exit from Weiyao while keeping the asset within the SMEE-origin corporate structure.

Chinese robotics developers appeared at CES 2026 with a stronger focus on commercial deployment, highlighting embodied intelligence and real-world applications as companies sought to raise international visibility beyond conceptual demonstrations.