Flexible printed circuit (FPC) specialist Flexium Interconnect has expressed optimism about demand for automotive applications in the long run, believing the worst has passed.

As air cooling grew insufficient for the heat dissipation of datacenters when running AI applications, L2A and L2L cooling methods are likely to see rising penetration to datacenters in the upcoming years.

The 2024 AI Expo, held at the Expo Dome in Taipei Expo Park from April 24^th to 26^th showcased cutting-edge AI innovations in smart manufacturing. Three keynote speeches, each unveiling groundbreaking AI solutions, stole the spotlight and underscored the transformative power of artificial intelligence in revolutionizing traditional manufacturing processes.