Neousys posts 1Q25 revenue gain amid global uncertainties

Taiwan’s Neousys Technology reported first quarter 2025 consolidated revenue of NT$418 million (US$13.94 million), buoyed by continued project deliveries despite external headwinds. The industrial PC maker said international developments remain the key variable for the second half of 2025, though Chairman Gao expressed cautious optimism for the year as projects mature.

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NAFCO’s May revenue dips due to exchange rate fluctuations; strong orders sustain positive full-year outlook

Aerospace fastener manufacturer NAFCO reported a 13.56% month-over-month decline in revenue for May 2025. The company attributed this drop primarily to exchange rate impacts and slower-than-expected new product certifications. While certification progress is expected to catch up in June 2025, the exchange rate effects remain difficult to control. Despite these challenges, NAFCO remains optimistic about its order book and prospects for the second half of 2025.

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Greenet set for TPEx debut, eyes 430 million kWh resale in 2025 amid surging green power demand

Greenet, the power sales subsidiary of Green Energy Investment Group J&V Energy Technology, will debut on the Emerging Stock Board of the Taipei Exchange (TPEx) on June 10, 2025. This marks the group’s first subsidiary to enter the capital market. With over 90% of its contracts extending beyond 10 years, Greenet is positioned for stable, long-term revenue growth, according to President Ya-sheng Tang.

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Samsung and SK Hynix lead AI-driven EDA revolution to power next-gen semiconductor design

South Korea’s semiconductor giants, Samsung Electronics and SK Hynix, are ramping up the adoption of artificial intelligence (AI)-driven electronic design automation (EDA) to bolster their competitive edge in next-gen chip production. The companies have started implementing AI-based design solutions across advanced process nodes and memory products, reporting notable progress in efficiency and innovation.

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Samsung’s DRAM yield jumps following bold redesign under new chief Jun Young-Hyun

Samsung Electronics is accelerating its push to reclaim semiconductor leadership, spotlighting its latest breakthrough in sixth-generation DRAM (1c node) yields. The development is fueling optimism about a potential rebound in the HBM market. Spearheading this turnaround is Jun Young-hyun, CEO and head of the Device Solutions (DS) division, who returned in May 2024 and initiated a high-stakes redesign of Samsung’s DRAM architecture to reverse recent setbacks.

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