The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards organization, has unveiled the High Bandwidth Memory 4 (HBM4) specification—a next-gen memory standard featuring major architectural and interface upgrades for dramatically improved bandwidth, capacity, and power efficiency.

At its “Global Brand Night” in Hong Kong on April 15, XPeng Motors unveiled its 2025 global flagship, the XPeng X9, and laid out an ambitious new AI roadmap. Chairman and CEO He Xiaopeng said the company is entering a transformative decade, evolving from a smart EV maker into a full-stack AI innovator.

China’s RF chip sector is facing a major disruption as Murata Manufacturing files five patent lawsuits against Maxscend Technologies in both China and South Korea, alleging that its MAX-SAW filters—commonly referred to as TF-SAW—violate five core Murata patents. Patent analysis indicates a broader risk, with nearly all TF-SAW-based products from Maxscend potentially exposed to systemic infringement claims.