Turvo commits to combustion engine parts for Bosch amid expanding EV footprint

Taiwan-based precision metal parts manufacturer Turvo International recently hosted a media tour, during which Chairman Tony Liu highlighted the company’s ongoing transformation in response to shifting industry trends. The company has actively expanded into the new energy vehicle (NEV) market while maintaining a strong and stable partnership with global Tier 1 supplier Bosch through a distinctive strategic collaboration model.

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Hon Hai Research Institute invests in ultra-wide bandgap semiconductor development

The Semiconductor Research Center at the Hon Hai Research Institute (HHRI), together with National Yang Ming Chiao Tung University (NYMCTU) in Taiwan and the University of Texas at Austin in the US have invested in forward-looking research on beta-gallium oxide (β-Ga2O3) ultra-wide bandgap (UWBG) semiconductors, which has led to significant breakthroughs in the satellite communications and high-power component sectors.

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Samsung lifts HBM yield as US tariffs loom over China-made chips

South Korean media have reported that Samsung Electronics has made notable progress in developing next-generation high-bandwidth memory (HBM). According to Chosun Biz, the company recently surpassed a test production yield of 40% for the logic die, produced using Samsung’s 4nm foundry process, a marked improvement over Baidu’s 15-19% yield for chips manufactured using the same technology.

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Hong Kong’s trade role dims under US-China tensions

Once hailed as Asia’s freest port and a gateway between China and the world, Hong Kong now finds itself increasingly swept up in the geopolitical undertow of US-China tensions. As Washington ratchets up tariffs on Chinese goods, the city, long treated as a separate economic entity, is no longer spared. The latest round of tariffs signals a deeper shift: the fading distinction between Hong Kong and the mainland in the eyes of US policymakers, raising fresh doubts about the future of “One Country, Two Systems.”

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