华为三折叠海外发布，售价3499欧元
2月19日消息，华为创新产品全球发布会在马来西亚吉隆坡召开，华为三折叠 Mate XT 非凡大师正式在海外发布，仅提供16GB+1TB版本，售价3499欧元（合人民币约26600元）。该版本在国内售价23999元。
19
Feb
19
Feb
最新消息：柔宇科技场地已标志为惠科显示分公司
2月19日，据最新消息，柔宇科技场地已标志为惠科显示分公司，惠科股份创业板融资95亿失败后现正在辅导期重新冲刺IPO！
18
Feb
Strong fundamentals for DRAM and NAND drive memory prices to rise in 2Q24
Chip manufacturers are actively promoting price rises in the second quarter, leading to an expected rise in DRAM and NAND flash prices during this period.
18
Feb
Gogoro unveils four key strategies to achieve energy and vehicle business profitability
On February 18, Gogoro held a spring press conference, where Interim CEO Henry Chiang stated that as an energy technology and scooter company, Gogoro has a clear goal: achieving profitability and sustaining steady growth.
18
Feb
ASE opens fifth factory in Penang, embracing AI-driven smart manufacturing
With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company’s fifth factory in Penang, Malaysia, officially opened on February 18, 2025.
18
Feb
Infineon ships first 8-inch SiC product to customers
According to Infineon’s press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released its first products in the first quarter of 2025. These products, produced in Villach, Austria, will offer premium SiC power solutions for high-voltage applications such as renewable energy systems, trains, and electric vehicles.
18
Feb
Hu Shan Autoparts advances AM 2.0 strategy, eyes growth in North America
As the world’s largest aftermarket (AM) car door handle manufacturer, Taiwan-based Hu Shan Autoparts has been actively advancing its “AM 2.0” product strategy in recent years. This initiative targets the mid-to-high-price market by offering premium upgraded components, aiming to enhance both quality and profitability.
18
Feb
DRAM manufacturers reportedly plan to cease DDR3, DDR4 production by late 2025
The DRAM market is shifting as falling prices due to weak demand prompt top players like Samsung Electronics, SK Hynix, and Micron to adjust their strategies. These companies are pivoting toward DDR5 and high-bandwidth memory (HBM) and may phase out DDR3 and DDR4 by 2025, anticipating a future focused on advanced memory technologies.
18
Feb
Former TSMC chairman Mark Liu launches new think tank to bolster US tech competitiveness
Mark Liu, the former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), is spearheading a bold initiative to enhance American technology leadership. According to a statement released by the University of California, Berkeley (UC Berkeley), Liu is establishing the Technology Competitiveness and Industrial Policy Center (TCIP) at the university, aiming to usher in a new era of advanced technology development and domestic production.
18
Feb
Trump’s off-the-cuff comments stoke global tensions, Taiwan moves to secure high-tech sector
US President Donald Trump has increasingly engaged with the media in unscripted exchanges, often deflecting criticism by blaming former administrations, including those of Joe Biden and Barack Obama. His off-the-cuff remarks, which frequently mirror the combative tone of his campaign rhetoric, have raised concerns worldwide. In Taiwan, Trump’s latest statements triggered the country’s first National Security Council meeting of 2025—not in response to Chinese military maneuvers, but due to the potential economic and geopolitical fallout of his remarks.