The continuous surge in generative AI applications is driving strong demand for High Bandwidth Memory (HBM), significantly benefiting Japanese suppliers of materials and equipment associated with HBM production. This trend is prompting these suppliers to make significant investments in expanding their production capacity.
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China’s semiconductor industry continuing to deepen, China’s local Electronic Design Automation (EDA) software products have made considerable progress in recent years and accelerated their development to bridge the 15 years gap with their American and European rivals.
SK Hynix has announced plans to expand production capacity for next-generation DRAM, including HBM, a critical component of AI infrastructure. This decision is in response to the growing demand for AI chips.
Apple is diversifying rather than expanding its supplier base in India, as indicated by its latest supplier list. Despite some concerns from the Indian government, China-based suppliers continue to play a significant role in Apple’s India strategy.
Memory module house Adata Technology has stepped up deployments for industrial memory and storage, revenue from which is expected to jump by over 50% year on year in 2024.
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself from competitors in Southeast Asia.