International foundry players including TSMC, SMIC, and GlobalFoundries (GF) are expected to either maintain or increase their capital expenditure in 2025, focusing on expanding capacity and investing in next-generation technologies such as advanced packaging and silicon photonics. In contrast, Samsung Electronics is prioritizing cost reduction amid ongoing losses in its foundry business, sparking concerns about a potential decline in its market share.

Taiwanese passive component manufacturers Yageo and Ample Electronic Technology have started 2025 with unexpected revenue growth, bucking the traditional first-quarter slowdown. As customer inventories normalize, industry analysts expect steady ordering patterns to sustain revenue momentum.

Amid intensifying competition in advanced semiconductor packaging, Samsung Electronics is reportedly taking direct control of glass substrate supply chain development, a critical enabler for next-generation AI chips and high-performance computing. Industry analysts suggest this strategic move aims to strengthen Samsung Foundry’s competitiveness by offering integrated solutions combining cutting-edge packaging, high-bandwidth memory (HBM), and novel substrate technologies.