At the 2025 ZGC Forum in Beijing, held from March 27 to 31, artificial intelligence (AI) dominated the agenda. At the event’s flagship “Future AI Pioneer Forum,” 01.AI CEO and Sinovation Ventures founder Kai-Fu Lee shared his perspective on the trajectory of generative AI in China.

Towa, a prominent name in Japan’s semiconductor manufacturing equipment industry, has introduced a new technology specifically designed for the sixth-generation high bandwidth memory (HBM4) advanced packaging. In addition to this development, the company revealed a strategic three-year midterm plan set to culminate in March 2028. The aim is to expand its sales channels throughout Asia for its leading equipment. Towa forecasts a 31% increase in consolidated revenue from March 2025 figures, expecting it to reach JPY71 billion (US$473.97 million), while net profit is projected to rise by 39% to JPY10.9 billion.

The memory market has shown signs of stabilization after a notable downturn, with recent price increases indicating a positive shift. This transition comes in the wake of manufacturers announcing impending price hikes, resulting in a rebound in spot market quotes for DRAM and NAND Flash products over the past month.

据“广州增城区发布”，3月26日，中微公司竞得广州增城区一宗工业用地，宣布拟投资30亿，建设公司华南总部及产品研发与生产基地。