Soitec navigates US-China semiconductor rivalry with strategic neutrality

As the US and China intensify their semiconductor sanctions, the G2 dynamic between these superpowers grows increasingly pronounced, pushing supply chains toward de-risking. This shift is reshaping the global layout of semiconductor foundries and, by extension, the strategies of upstream material suppliers. French semiconductor materials leader Soitec, renowned for its proprietary Smart Cut technology, plays a pivotal role in this evolving ecosystem. Specializing in silicon-on-insulator (SOI) wafers, Soitec commands over 70% of the global SOI market, with applications spanning 5G, AI, automotive electronics, and RF components.

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Hisense U8QG specifications and prices for the U.S.

Hisense has launched its 2025 in the U.S. with full specifications and pricing. The top of the line is occupied by the Hisense U8QG Mini LED series. Just like in Europe, in the U.S., it comprises five models: Hisense 100U8QG – specifications; USD 7000 Hisense 85U8QG – specifications; USD 3500 Hisense 75U8QG – specifications; USD 2300 Hisense 65U8QG – specifications; USD 1900 Hisense 55U8QG…

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Amazon launches Nova Sonic to advance voice AI

Amazon has unveiled Nova Sonic, a new voice-specific model that integrates speech understanding and generation, marking a significant advancement in the evolution of voice AI. Designed to power automated customer service and AI agents, Nova Sonic aims to elevate the realism and responsiveness of voice interactions across industries such as travel, education, healthcare, and entertainment.

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EU launches AI continent action plan to compete with US, China

The European Commission has launched the “AI Continent Action Plan” to compete with the US and China in AI. This initiative aims to enhance AI data and computing infrastructure while easing business regulations and transforming Europe’s talent and industries into AI innovation leaders. Key elements of the plan were presented by EC President Ursula von der Leyen at the Paris AI Action Summit in February 2025.

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