Cybersecurity is becoming increasingly vital in automotive electronics and electrification supply chains, as breaches could paralyze the entire system. UPStream reports 409 cyberattacks in the automotive and smart mobility sectors in 2024, a 39% increase from the previous year, with electric vehicle charging infrastructure emerging as a primary target.
At the end of February, I attended the “Breakthrough Technology Dialogue” in Singapore—a gathering of tech elites from around the world. I aimed to capture the essence of each speaker’s remarks while blending in my own observations, offering a glimpse into their collective worldview.
TSMC unveiled plans to nearly triple its investment in the United States to US$165 billion, a move that reshapes the global chip industry landscape amid surging artificial intelligence demand and intensifying US-China technological competition.
India, the world’s most populous country with a population of over 1.4 billion, has enormous growth potential in the network communications market. In the past, India lagged behind others in 3G and 4G development due to a number of factors, such as a market over-crowded with competitors, weak telecommunications infrastructure, and poor policy implementation. However, the arrival of the 5G era has gradually changed the landscape of India’s telecommunications market, according to DIGITIMES’s latest report covering India’s 5G market.
Backed by state subsidies and a self-sufficient supply chain, China is ramping up SiC substrate and mature process chip production at an unprecedented pace. The expansion is fueling fears of a global oversupply and intensifying price competition for industry leaders like Rohm Semiconductor and Wolfspeed.
Facing economic headwinds and escalating trade tensions, China is refocusing on its tech sector, with President Xi Jinping recently convening a rare symposium with high-tech entrepreneurs. This move signals Beijing’s renewed commitment to technological innovation and industrial upgrades as key drivers of economic growth.