Phison CEO sees years of NAND shortage, AI growth chance
Lightmatter sets optical interconnect blueprint as AI hits copper wall
AI data centers are approaching a physical limit: as scale-up architectures stretch across multiple racks and SerDes speeds near 448G, copper’s effective transmission distance is shrinking to just a few dozen centimeters, accelerating the industry’s shift toward all-optical interconnect architectures.
China’s Vertilite commits US$741M to InP laser chips for AI optical interconnects
Giant warns rising bicycle parts costs will pressure margins
Giant said rising raw material prices and price hikes for components from Japanese supplier Shimano, starting from August 2026, will add cost pressure, prompting the bike maker to raise prices on new products to offset the impact. Even so, the company said short-term gross margins are unlikely to hold at prior levels.
China battery makers rework costs as lithium prices fall and taxes rise
LG, Nvidia step up humanoid push with robot data factory
Nvidia’s Madison Huang is set to visit LG Electronics’ Yangjae R&D campus in Seoul on August 18 to inspect the company’s robot data factory and hold closed-door talks with senior LG executives on robotics cooperation, according to Yonhap and Chosun Biz.
AMD eyes Taalas: will the system ditch HBM, advanced packaging, and 3D stacking?
Nvidia closing in on US$100B credit guarantee deal for OpenAI’s Ohio data center
Samsung weighs Giheung R&D line for 2nm HBM foundry capacity
Samsung Electronics is reportedly considering repurposing the second line at its next-generation semiconductor R&D complex in Giheung into a foundry send-fab, a shift that would add advanced-node capacity as demand for AI memory strains leading-edge capacity.