China steel unit expands semiconductor business, eyes biomedical growth

Thintech Materials, a subsidiary of China Steel Corporation, is ramping up its semiconductor operations with expected significant growth by 2025, driven by target and evaporation materials production. The company is also diversifying into biomedical technology, with Taiwan’s first accelerator-based boron neutron capture therapy equipment scheduled for delivery this year.

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Malaysian IC design houses awaiting details of Arm deal

The Malaysian government recently announced a technology licensing agreement worth US$250 million with silicon intellectual property (IP) powerhouse Arm. The deal aims to assist the development of IC design in Malaysia. While the government is pinning hopes on the agreement, local companies have urged officials to release details as soon as possible. They point out that Malaysia faces significant challenges in the global semiconductor race.

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Huawei’s US$119B boom: Enterprise business takes the lead in 2024

Huawei hosted the Huawei China Partner Conference 2025 at the Shenzhen Convention and Exhibition Center, bringing together industry leaders and business partners under the theme “Born out of aggregation, wisdom at work.” During his keynote speech, Tao Wang, Huawei’s Executive Director, and Chairman of the ICT Infrastructure Managing Board, highlighted the company’s solid 2024 performance.

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Oracle to provide secure cloud and AI services to Singapore’s defense ministry

Oracle has announced a partnership with Singapore’s Ministry of Defence (MINDEF) to deliver independent cloud and AI services, marking its first such collaboration in Southeast Asia. The initiative aims to enhance MINDEF’s intelligence analysis and decision-making capabilities amidst increasing cyber threats in the region, according to Reuters and Oracle’s press release.

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