Nvidia’s ability to sell high-performance AI chips in China has been sharply limited by US export licensing rules, which have restricted shipments of its H20 and H200 products. The controls have already forced Nvidia to take a US$4.5 billion inventory charge and have left the company uncertain about future revenue from China. Meanwhile, local competitors, some strengthened by recent IPOs, are expanding rapidly, potentially reshaping the global AI market.

As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly leading a market recovery, gradually breaking free from the post-pandemic overexpansion downturn. Despite the rapid market recovery for IC substrates, the short-term problem of T-glass fiberglass shortages remains. Although improvement is expected in the second half of 2026, high-end ABF substrate supply is likely to remain tight until the end of the year, and nearly all customers are facing limitations in sourcing fiberglass.

On February 24, 2026, Taiwan Semiconductor Manufacturing Company (TSMC) crossed the US$2 trillion market capitalization mark, becoming the eighth company in US stock market history to reach the milestone and the first from Taiwan. The achievement places TSMC sixth in the global rankings by market value, behind Nvidia, Apple, Alphabet (Google), Microsoft, and Amazon.