Passive components maker Inpaq, under Passive System Alliance (PSA), held its annual investor conference. Looking ahead, CEO Eunice Chen expects 2025 orders driven by the PC/notebook (PC/NB) replacement cycle to be much stronger than supply chain forecasts, pushing utilization rates above 90%. She is optimistic that this strong order momentum will extend into 2026, becoming a key driver for steady growth in antenna product shipments.

As 2025 draws to a close, the global semiconductor industry has undergone a fundamental transformation marked by heightened geopolitical tensions, supply chain restructuring, and an unprecedented surge in AI-driven demand. What distinguishes this year from previous cycles is the shift from aspirational roadmaps to hard-edged execution, where manufacturers must deliver not just technological advancement but reliable, scalable production under increasingly complex constraints.

A magnitude 7.0 earthquake off Taiwan’s eastern coast late on December 27 disrupted parts of the island’s semiconductor supply chain, after several wafer fabs reported damage to quartz furnace tubes critical to diffusion processes, according to industry sources. While no structural damage to factories was reported, the incident has sharpened market attention on recovery timelines at major chipmakers, including TSMC, Powerchip Semiconductor Manufacturing Corporation (PSMC), and Nanya Technology.