27
Nov
26
Nov
Intel secures US$7.865 billion in CHIPS Act subsidies, lower than initial memorandum amount
Revised Award Provides Up to $7.865 Billion in Direct Funding, Down from $8.5 Billion, to Support Intel’s $100+ Billion Expansion Plan Across Four U.S. States
26
Nov
US grants US$59 million in chip subsidy to BAE Systems, Rocket Lab
The US Department of Commerce has awarded two significant grants under the CHIPS Incentives Program. The funding will go to BAE Systems and Rocket Lab to advance the country’s supply chain security in vital defense and space industry components.
26
Nov
Huawei unveils its ‘most powerful’ new device ahead of expanded US ban
Huawei’s product launch event took place on the afternoon of November 26, showcasing what it claims to be the “most powerful” Mate in history, along with the fourth iteration of Harmony Intelligent Mobility Alliance—”Maextro,” developed in collaboration with JAC Motors. This announcement comes just before the US is expected to announce an expansion of its restrictions against China, drawing significant attention from the public and industry observers.
26
Nov
Global smartphone shipments to see six-year CAGR of 3.6% from 2024-2029, says DIGITIMES Research
DIGITIMES Research, by synthesizing supply chain information, regional market conditions, and analyzing global political and economic trends, forecasts that global smartphone shipments will reach 1,181.4 million units in 2024, marking a growth of 4.9%. Looking ahead over the next five years, there is an anticipated demand for feature phone users in regions such as India, Southeast Asia, Latin America, and Africa to upgrade to smartphones, while the ongoing deployment and expansion of 5G networks in these markets are expected to further drive their smartphone shipments. DIGITIMES Research estimates that the global annual shipment growth rate will range between 3% and 4%, with a compound annual growth rate (CAGR) of 3.6%.
26
Nov
Shifting gears: US tariffs reshape global automotive supply chain
Heightened US tariff policies are rattling the automotive industry, threatening higher vehicle costs. Industry insiders note that while the US mandates final assembly domestically, sourcing 20,000-30,000 components per vehicle locally is impractical. Tier 1 suppliers, with production hubs in Mexico, remain largely unaffected by policy shifts.
26
Nov
HPE unveils groundbreaking supercomputing lineup with fanless liquid cooling
Hewlett Packard Enterprise (HPE) has rolled out a new portfolio anchored by the HPE Cray Supercomputing EX system, debuting the industry’s first fully fanless direct liquid cooling (DLC) architecture. The suite spans compute nodes, networking, and storage, alongside newly introduced software solutions.
26
Nov
Taiwan’s TMYTEK aims for IPO after securing US$25M Series B for satellite tech
Taiwan-based millimeter wave (mmWave) technology company TMYTEK is preparing to go public next year following a successful US$25 million Series B funding round that brought its total capital to US$54 million. The company has positioned itself as a key player in the emerging multi-orbit satellite communications market.
26
Nov
Samsung’s market risks, SK Hynix’s fab dependence: Diverging paths to decoupling from China
South Korean media report that SK Hynix and Samsung Electronics have reduced their reliance on China over the past seven quarters. SK Hynix’s China revenue dropped from 30% to 24%, while Samsung’s equipment assets in China fell from 8% to under 5%, signaling ongoing decoupling efforts among South Korea’s semiconductor giants.
26
Nov
Xiaomi readies own mobile chip, pressuring MediaTek and Qualcomm
Xiaomi is preparing a self-designed mobile processor for its upcoming smartphones in an effort to reduce its reliance on foreign suppliers Qualcomm and MediaTek.