士兰微：获得政府补助1837.70万元
12月25日，士兰微(600460.SH)公布，公司于2024年12月24日收到与收益相关的政府补助1,837.70万元，占公司2023年度经审计归属于上市公司股东的净利润的绝对值的51.35%。
26
Dec
26
Dec
胜利精密拟定增募资19.5亿元 用于苏州车载显示玻璃产品扩能建设项目等
12月25日晚间，胜利精密公告，拟向包括公司控股股东高玉根在内的不超过35名特定对象发行不超过10.2亿股公司股份，其中高玉根认购股票数量不低于本次发行股票数量的8.26%。此次公司拟募集资金总额不超过19.5亿元。
26
Dec
26
Dec
星星科技在宁波成立投资公司
企查查APP显示，12月23日，宁波衡道投资有限公司成立，注册资本3000万元，经营范围包含：以自有资金从事投资活动。企查查股权穿透显示，该公司由星星科技（300256）全资持股。
26
Dec
夏普11.6亿元出售堺市总部大楼给积水化学
12月26日，鸿海旗下夏普表示，已经与积水化学工业株式会社就以250亿日元（约合11.6亿元人民币）转让本公司所持有的固定资产达成协议，资产包括位于大阪府堺市的建筑物等。
26
Dec
柔宇科技旗下资产二拍流拍，较一拍降价20%
12月25日消息，今日早间，深圳柔宇显示技术有限公司（下称“柔宇显示”）名下资产二拍流拍。阿里资产网显示，二拍起拍价为9.84亿元，较一拍降价20%，此次拍卖超5000次围观。
25
Dec
SK Hynix prepares for mass production of 16-layer HBM3E amid intensifying competition
As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its 16-layer HBM3E products as planned. The significance of this achievement is heightened by the fact that the same stacking technology will be applied to HBM4.
25
Dec
China’s EV price war: 2 years of financial turmoil and supply chain chaos
China’s electric vehicle (EV) industry has endured a two-year price war, leading to significant profit compression across the supply chain. Automakers have slashed costs to defend their market share, but this strategy has intensified upstream financial strain. Suppliers face cash flow crises, disrupting component stability and driving up costs, creating a self-perpetuating cycle of instability.
25
Dec
Megaforce embraces AI to drive smart healthcare innovations
Megaforce, a Taiwan-based leader in precision plastics molding, laser optics, and biomedical solutions, is ramping up its focus on AI applications. The company now offers system integration, AI model development, database construction, and on-premises computing capabilities.
25
Dec
AI-powered inkjet tech breakthrough enables precision coating for advanced semiconductors
Elephantech, a Tokyo-based printed electronics manufacturer, has introduced NeuralJet™, an artificial intelligence (AI)-powered inkjet technology that improves precision in semiconductor packaging applications through the correction of printing variations. The technology addresses specific challenges in advanced packaging processes, including those used in AI semiconductor production.