UMC revenue climbs to a 45-month high as wafer prices rise
Jiuhan lifts first-half profit 400% on NT$11 billion order book
MA-tek reports record July revenue on glass-substrate testing demand
Memory drives 62% of Nvidia Vera Rubin’s cost — SOCAMM2, not HBM4, leads the bill
Memory chips account for roughly 62% of the cost of Nvidia’s next-generation AI platform, Vera Rubin, according to a new cost breakdown. The biggest single line item is not HBM4 but SOCAMM2, the LPDDR5X memory module attached to the Vera CPU, which runs close to US$20,000 per Superchip.
UK Semiconductor Center makes Taiwan debut at SEMICON, strengthening strategic ties
The UK Semiconductor Centre (UKSC), a leading organization in the UK semiconductor ecosystem, will lead a delegation of British semiconductor companies and research institutions to SEMICON Taiwan 2026, seeking to deepen strategic ties between Taiwan and the UK.
Chinese automakers push Europe share to 9% as trade fight intensifies
PSA, NTUT sign NT$50 million AI research and talent deal
Samsung set to double BOE TV panel orders as Korean TV makers reshuffle suppliers
Samsung Electronics is expected to double its purchases of TV LCD panels from BOE in 2026 while cutting orders from CSOT, as Samsung and LG Electronics rebalance their supplier mixes in an LCD market increasingly dominated by Chinese panel makers.
Samsung tackles AI memory wall with zHBM, V10 BV-NAND concepts
Samsung Electronics is betting on new 3D memory architectures and tighter processor-memory integration as AI workloads put growing pressure on data movement, storage capacity and power efficiency.