As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation advanced packaging, is gaining momentum. South Korean companies such as Samsung Electro-Mechanics (SEMCO) and LG Innotek are gearing up to compete for leadership in this emerging segment.

Samsung Electronics and SK Hynix are pushing forward their production schedules for sixth-generation high-bandwidth memory to February 2026. Industry sources and South Korean media reports confirm the accelerated timeline. The two companies aim to begin volume manufacturing of HBM4 months earlier than previously anticipated. The goal is to meet surging demand for artificial intelligence infrastructure. By accelerating their timelines, the South Korean chipmakers seek to solidify their dominance in the AI memory market before global competitors can scale similar technologies.

As AI workloads intensify and data centre architectures evolve, optical communications vendors are positioning co-packaged optics (CPO) and silicon photonics (SiPh) as core mid- to long-term growth markets. LuxNet expects 800G products to surpass 400G as the market mainstream in 2026, with 1.6T products entering initial shipments and supporting growth over the next two to three years. TrueLight is moving into the AI high-performance computing (HPC) supply chain via continuous-wave (CW) laser foundry services and expects the foundry revenue share in 2026 to exceed 2025 levels.