TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently announced a memorandum of understanding (MOU) with Amkor. TSMC’s front-end wafer fabrication plant in Arizona will closely collaborate with Amkor’s back-end packaging and testing facility to streamline the product manufacturing cycle.

As the energy sector’s digital transformation accelerates, energy infrastructure is increasingly reliant on Internet technologies and Internet of Things (IoT) devices, raising concerns about heightened cybersecurity risks. SolarEdge, a leading energy equipment manufacturer, warned that the growing integration of IoT and artificial intelligence (AI) technologies is increasing the likelihood of cyberattacks, underscoring the critical need for stronger cybersecurity measures in the industry.

Content recommendation platform Taboola established an AI R&D center in Taiwan in 2021, led by Vice President of Engineering Ning Ning Yu, who oversees both the Taiwan and Los Angeles R&D centers. The center focuses on developing natural language processing (NLP) and recommendation system technologies.