2D materials: from memory entry to logic’s future

Two-dimensional (2D) materials were once regarded as important candidates for extending semiconductor scaling. Because they are only an atom thick, they are theoretically very suitable for fabricating extremely small, ultra-low-power transistors. However, once these ideas move into advanced logic processes, challenges begin to surface. The problem lies in the fact that using 2D materials to fabricate FETs requires process control that is nearly at the single-atom level.

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PQC security chips likely to adopt plug-in deployment for data protection

As cybercriminals gain access to increasingly more computing power capable of breaking existing encryption algorithms in seconds, the standard for cybersecurity has shifted. It is no longer measured by how long it can hold but by ensuring attackers gain absolutely nothing. Post-quantum cryptography (PQC) security chips will therefore adopt a scorched-earth policy to guarantee that critical data cannot be accessed.

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CHIPX eyes Malaysia for 8-inch GaN-on-SiC wafer fab

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026.

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AI chips run too hot: Engineers race to reinvent cooling

The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end AI accelerators now consume power at kilowatt levels, producing concentrated heat fluxes that challenge existing cooling methods, potentially limiting performance and reliability across data center systems.

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