Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated that the computing capability necessary for future AI applications could be several times larger than current values, potentially up to tenfold. He emphasized that current AI chips are insufficient to support future computing needs, and the key to increasing chip capability lies in SiPh technology.

Recent reports suggest that Chinese GPU startup Xiangdixian Computing Technology has collapsed due to funding issues and dismissed its entire workforce. However, the company later issued a statement clarifying that it is undergoing organizational restructuring and has not commenced dissolution or liquidation.

9月6日，高通(QCOM.US)首席执行官Cristiano Amon在接受采访时表示，该公司正与三星电子(SSNLF.US)和谷歌(GOOGL.US)合作，探索开发可与智能手机连接的混合现实(VR)智能眼镜。