24
Dec
23
Dec
AMD arms itself to challenge Nvidia’s push into AI PC market
The PC market, traditionally dominated by x86 processors from Intel and AMD, is now abuzz with rumors about Nvidia’s entry into the AI PC processor market. The company is reportedly preparing to challenge Qualcomm, Intel, and AMD with its upcoming solutions.
23
Dec
TSMC’s wafer manufacturing 2.0 reshapes advanced packaging market
TSMC introduced “Wafer Manufacturing 2.0” in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging supply chain, driven by fresh investments from OSAT providers, IDMs, and new entrants that are disrupting traditional roles.
23
Dec
Taiwan’s auto sector gears up for MaaS innovation, Volvo and Hotai leading the way
Taiwan’s automotive sector is witnessing a shift toward digital and smart transformation, driving the Mobility as a Service (MaaS) industry into a new phase of growth. Global car brands, including Volvo, are capitalizing on this momentum by introducing diversified mobility services to meet evolving consumer needs.
23
Dec
TSMC capacity expansion powers supply chain for 2025 boom
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow recovery in semiconductor demand, TSMC remains on track to achieve record-breaking growth.
23
Dec
CIP, UMC sign CPPA for Fengmiao offshore wind farm, boosting semiconductor green energy goals
Copenhagen Infrastructure Partners (CIP) has signed a Corporate Power Purchase Agreement (CPPA) with United Microelectronics Corporation (UMC) for the development of the Fengmiao Phase I Offshore Wind Farm through its flagship fund “CI V.”
23
Dec
WKPT diversifies into electronics supply chain with global expansion
World Known Precision Industry (WKPT), Taiwan’s largest supplier of metal-processed parts for commercial vehicles, is advancing its global footprint with new plants in the US, Taiwan, and China. At a recent earnings call, Chairman Kevin Lu outlined plans to gradually transform WKPT from a traditional machining specialist into a key player in the electronics supply chain.
23
Dec
Innolux expands semiconductor footprint with FOPLP and silicon photonics
Display panel specialist Innolux is intensifying its push into the semiconductor sector, expanding its focus beyond fan-out panel-level packaging (FOPLP) to include silicon photonics. The company’s strategic shift is reflected in its plans to allocate over 15% of its capital expenditure to semiconductors by 2025.
23
Dec
Innolux seeks assistance to advance FOPLP technology
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system. The initiative aims to enhance packaging testing for major semiconductor manufacturers, thereby boosting production capacity for fan-out panel-level packaging (FOPLP).
23
Dec
Kioxia’s IPO raises questions about AI bets and reliance on NAND
Japanese NAND flash maker Kioxia debuted on the Tokyo Stock Exchange’s Prime Market on December 18, marking a significant milestone. Despite an initial stock price surge, the company’s current market value stands at less than half of the JPY2 trillion (approx. US$13 billion) valuation it held upon separating from Toshiba in 2018.