AMD is reportedly shifting its R&D centers away from north and central Taiwan due to power supply concerns. On the afternoon of the 21st, Senior VP of AMD, Mark Fuselier, led a delegation to meet with Taiwan’s Minister of Economic Affairs, Chih-Hui Kuo.

Elite Material, a top manufacturer of high-performance copper clad laminates (CCL), has signed a strategic cooperation agreement with Zhen Ding, a global leader in PCB production. This partnership aims to enhance end-customer engagement, advance PCB material R&D, and promote smart, sustainable development.

Microsoft has been actively promoting Small Language Models (SLMs), expanding its Phi series with the introduction of the Phi-3.5 line. This new series includes the Phi-3.5-mini, Phi-3.5-MoE, and Phi-3.5-vision models, with parameters typically ranging from billions to tens of billions.

Tata Motors, the leading commercial vehicle provider and largest EV brand by sales in India, signed an MoU with Delta Electronics India and Thunderplus Solutions for charging infrastructure investment.