ESMC breaks ground on Dresden fab

European Semiconductor Manufacturing Company (ESMC), a joint venture between TSMC, Robert Bosch, Infineon Technologies and NXP Semiconductors, has held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. The event brought together government officials, customers, suppliers, business partners and academia to celebrate a milestone in establishing what will be the EU’s first-ever FinFET-capable pure-play foundry.

Continue reading

IPC industry optimistic on growth in 2H24 due to market stabilization

Due to several factors such as inventory de-stocking and investment delays caused by weak economic environments, many industrial PC (IPC) companies faced declines in the first half of 2024 that resulted in a year-on-year decrease in performance. However, several companies have indicated their positive attitude for the second half of 2024 and even into 2025 as China’s market becomes stable while general economic situations see potential growth in the upcoming future.

Continue reading

Global semiconductor manufacturing industry strengthens in 2Q24, SEMI reports

The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure, and an increase in installed wafer fab capacity, according to a recent report published by SEMI in collaboration with TechInsights. While the slower recovery in some end markets impacted the pace of growth in the first half of this year, the surge in demand for AI chips and high bandwidth memory (HBM) created strong tailwinds driving industry expansion.

Continue reading