On August 6th, WT Microelectronics, a leading IC distributor based in Taiwan, held its investor conference where Chairman Simon Cheng expressed confidence that current semiconductor market headwinds are only a short-term phenomenon.
The US Department of Commerce and SK Hynix have signed a non-binding preliminary memorandum of terms to provide up to US$450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility in Indiana.