Elon Musk lands priority for Nvidia GB200 delivery in January with US$1.08 billion

Elon Musk’s artificial intelligence company xAI has made headlines with its urgent push for advanced AI hardware. Industry sources indicate that Musk directly approached Nvidia CEO Jensen Huang, offering a premium to expedite a US$1.08 billion order. Production of these AI server systems will be handled by Foxconn, Nvidia’s key manufacturing partner.

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TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027

TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x reticle size. This advancement will accommodate twelve HBM4 memory stacks, providing unprecedented performance enhancements for artificial intelligence (AI) and high-performance computing (HPC) chips.

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DeepX AI chip achieves up to 90% yield with Samsung’s 5nm process

South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics’ foundry division, the company has achieved an 88% yield rate using advanced 5nm process technology, with expectations to surpass 90% in mass production—a promising indicator for this cutting-edge AI hardware initiative.

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Chipmakers fight for entrance as Huawei ignites satellite mobile communication opportunities

Recently, Huawei’s executive director and chairman of the board of directors of the consumer business group (BG), Richard Yu, announced that the new foldable flagship smartphone, Mate X6, will feature a triple-network satellite version. In addition to supporting two-way satellite messaging and two-way calling, the device will now also incorporate low Earth orbit (LEO) satellite internet.

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