ACM launches Ultra C vac-p flux cleaning tool for chiplets, breaking into FOPLP market

ACM Research has introduced its Ultra C vac-p flux cleaning equipment, specifically designed for fan-out panel-level packaging (FOPLP). This new tool employs vacuum technology to efficiently remove flux residues from chiplet structures. ACM has also confirmed receipt of a purchase order from a prominent Chinese semiconductor manufacturer. The order has been shipped to the customer’s facility in July.

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Knobs and buttons make partial return as trend in automotive human-machine interface

In the 2010s, the automotive industry ventured into touch control interfaces, with pioneers like Tesla, Mercedes Benz, and Nissan leading the charge. However, with the European New Car Assessment Programme (Euro NCAP) revising its vehicle safety assessment standards, automakers are beginning to reconsider and even reduce touch control interface applications.

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CoSAI establishment sees Intel, Google, and IBM joining

The Coalition for Secure AI (CoSAI), proposed by the global open standards organization OASIS Open, has been officially established. Its goal is to provide industry practitioners and developers with the necessary guidelines and tools to help create secure-by-design AI systems. Members include tech giants such as Intel, Google, IBM, Nvidia, and Microsoft, among other organizations.

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