Taiwan’s Favite, a leading supplier of automated optical inspection (AOI) equipment for LCD, OLED, and mini/microLED displays, has begun shipping microOLED AOI equipment to the Chinese market. The company is also expanding its focus to advanced packaging applications like fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging (FOPLP).

DoIT and SIIQ jointly held the 2024 International Taiwan-Japan Semiconductor Technology Symposium on September 4 in Nangang. DoIT’s director general Chyou-Huey Chiou stated that there is a lot of collaboration potential between Taiwan and Japan in mechanics, biomedicine, green energy, and ICT. Japan also hopes to make Kyushu Japan’s Silicon Island through partnerships with Taiwan.

Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated that the computing capability necessary for future AI applications could be several times larger than current values, potentially up to tenfold. He emphasized that current AI chips are insufficient to support future computing needs, and the key to increasing chip capability lies in SiPh technology.

Recent reports suggest that Chinese GPU startup Xiangdixian Computing Technology has collapsed due to funding issues and dismissed its entire workforce. However, the company later issued a statement clarifying that it is undergoing organizational restructuring and has not commenced dissolution or liquidation.