Samsung, SK Hynix keen to develop new TSV, focus ring, debonding solutions for next-gen HBM

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology used in this field. Memory manufacturers Samsung Electronics and SK Hynix are reportedly collaborating with partners to develop these next-generation solutions.

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GadgeTek sees surging sales in US

GadgeTek, an Acer Group subsidiary, has achieved robust sales in the US market after launching its flagship store on Amazon’s e-commerce platform. In June, the company reported sales of 30,000 units, with over 10,000 items sold during Amazon’s Prime Day, highlighting the robust demand for its products.

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SK Group head believes Nvidia’s success model may face challenges in 2-3 years

In a forum hosted by the Korean Chamber of Commerce and Industry (KCCI) in Keiju, KCCI Chairman and SK Group chairman Chey Tae-won told participants that Nvidia may face a new round of challenges in 2-3 years as companies have yet to find profitable business models for artificial intelligence (AI) technologies and some uncertainties might challenge Nvidia’s leadership status.

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