华为新智能手表通过认证：配无线充电底座，有望为GT系列产品
7 月 23 日消息，型号为 VLI-B29、VLI-B19 的华为新手表通过国内 CQC 认证，配充电底座，支持 18W 充电。
23
Jul
23
Jul
投资3.5亿元，纳米微晶玻璃光学盖板项目淄博投产，年产3600万片
据淄博日报，7月21日，张店经济开发区物联网产业园，山东飒露光学科技有限公司光学盖板项目车间，技术人员正在对纳米微晶玻璃光学盖板进行检测。该项目是市重大项目，投资3.5亿元。目前，700余台设备已进厂并正式投产，7月份已实现日产7万片，年底可达到日产12万片，实现年产3600万片光学盖板的产能。
23
Jul
鸿海处分专利权与专门技术给夏普
7月19日，鸿海公告，子公司FG INNOVATION COMPANY LIMITED处分专利权及专门技术无形资产，给鸿海转投资的日本夏普，处分利益2400万美元。
23
Jul
22
Jul
Samsung increases number of MPW service offerings for fourth consecutive year
Samsung Electronics is set to increase its Multi-Project Wafer (MPW) service offerings for the fourth consecutive year, with plans to raise the number to 35 in 2025. This move not only aims to strengthen partnerships with IC design houses in the AI era but also assist startups in product mass production.
22
Jul
ThinTech eyes advanced packaging opportunities
ThinTech Materials Technology (ThinTech) anticipates stronger performance in the second half of 2024, buoyed by warming demand for panels and the successful development of Fan-Out Panel Level Packaging (FOPLP). Following strong sales in May and June, the company’s outlook remains positive.
22
Jul
BYD expands manufacturing and distribution presence in Southeast Asia
Chinese electric vehicle (EV) maker BYD is rapidly expanding its presence in Southeast Asia. The company plans to establish new assembly plants in Cambodia and Indonesia to complement its existing facility in Rayong, Thailand. BYD is also growing its dealership network and introducing more competitively priced models in the region.
22
Jul
FOPLP under advanced packaging spotlight after CoWoS
Demands for advanced packaging services have surged as every smartphone is expected to be equipped with generative AI applications in the future. Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei emphasized in a recent earnings conference that AI chips have kept its Chip-on-Wafer-on-Substrate (CoWoS) production line busy, repeatedly stating that capacities remain tight despite doubling production lines.
22
Jul
AI PCs generate buzz but face supply chain skepticism over replacement wave
AI PCs are generating considerable buzz, but its supply chain remains skeptical about their potential to spark a widespread replacement cycle. The primary obstacles are the steep prices of AI PCs and the absence of a killer application. It’s more likely that incremental upgrades will boost AI PC adoption rather than consumers rushing to replace their existing devices.
22
Jul
Taiwan prioritizes drones and AI in new defense technology unit
Taiwan has established a new Defense Innovation Unit (DIU) to accelerate the integration of drones and Artificial Intelligence (AI) systems into its military strategy. This unit, modeled after the US DIU, will bridge the gap between civilian technological advancements and their applications in the defense sector.