C. C. Wei, chairman and CEO of TSMC, introduced the concept of “Foundry 2.0” and provided additional information regarding the company’s advanced 2nm and A16 process technologies at its investor’s conference on July 18. Wei also addressed the current shortage of CoWoS packaging, which is anticipated to be alleviated by the end of 2025.
Intel is set to launch a new initiative at the 2024 Paris Olympics and Paralympics that will introduce innovative AI applications built on Intel’s hardware and software into the two major sporting events. This aims to bring a next-generation interactive experience to event organizers, athletes, spectators, and fans.
TSMC announced that revenue and margins exceeded guidance in the second quarter of 2024, and it expects revenue for the third quarter to increase 9.5% sequentially at the midpoint.
To expedite investments and establish a local electronics manufacturing ecosystem, India reportedly plans to speed up visa issuance for Chinese engineers and clarify the conditions under which Chinese investments will be allowed.
Generative AI continues to fuel global server business potential spreading like wildfire. Taiwanese manufacturers dominate the global AI server assembly industry, representing as much as 90% of it. This is due to their exceptional skills in server design, research and development, and contract manufacturing. Taiwan is the primary recipient of this market dominance.