Key TSMC earnings takeaways: CoWoS supply-demand balance by 2025, N2 and A16 details

C. C. Wei, chairman and CEO of TSMC, introduced the concept of “Foundry 2.0” and provided additional information regarding the company’s advanced 2nm and A16 process technologies at its investor’s conference on July 18. Wei also addressed the current shortage of CoWoS packaging, which is anticipated to be alleviated by the end of 2025.

Continue reading

Players’ cards in AI server assembly market

Generative AI continues to fuel global server business potential spreading like wildfire. Taiwanese manufacturers dominate the global AI server assembly industry, representing as much as 90% of it. This is due to their exceptional skills in server design, research and development, and contract manufacturing. Taiwan is the primary recipient of this market dominance.

Continue reading