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01 Aug
Latest News and Trends

Thintronics wins proposed US CHIPS incentives for advanced substrate technology

  • August 1, 2026
  • By author-avatar jeff
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research and Development Office for up to US$50 million in incentives under the CHIPS and Science Act.

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01 Aug
Latest News and Trends

Chinese display makers move deeper into Korean cockpits as BOE wins Hyundai’s flagship display program

  • August 1, 2026
  • By author-avatar jeff

Chinese display suppliers are expanding into South Korea’s automotive supply chain as competition shifts beyond televisions and smartphones toward software-defined vehicles, where cockpit displays are becoming a defining part of the user experience.

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01 Aug
Latest News and Trends

Huawei’s Kirin X90 Plus and XE90 power its lightest laptop and next foldable PC

  • August 1, 2026
  • By author-avatar jeff
Huawei has introduced two PC processors, the Kirin X90 Plus and Kirin XE90, alongside new HarmonyOS laptops designed to extend its in-house chip strategy across high-performance and ultra-light computing.

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01 Aug
Latest News and Trends

At OCP’s Taiwan summit, servers take a back seat to optics and advanced packaging

  • August 1, 2026
  • By author-avatar jeff

When the agenda for this year’s OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest, and ASE are sharing the stage with Microsoft, Nvidia, and Google.

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01 Aug
Latest News and Trends

Lite-On expands InP optical push with US$34.3 million stake in Singapore’s DenseLight

  • August 1, 2026
  • By author-avatar jeff
Lite-On Technology is extending its optical core competencies into system-level optical communications for AI data centers, announcing a US$34.3 million investment for a 21% stake in Singapore-based indium phosphide (InP) optical component maker DenseLight Photonics, along with a seat on its board.

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31 Jul
Latest News and Trends

MJ Taiwan names Maverick Shih chair, prioritizes AI, cybersecurity and space technologies

  • July 31, 2026
  • By author-avatar jeff

The Monte Jade Science and Technology Association of Taiwan (MJ Taiwan) elected Maverick Shih, chairman of Acer Cyber Security (ACSI), as its 13th chairman during the association’s first board meeting of its new term on July 30.

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31 Jul
Latest News and Trends

Analysis: The AI buildout stopped being a demand story

  • July 31, 2026
  • By author-avatar jeff

For three years, the constraint on artificial intelligence was how much compute the hyperscalers wanted to buy. The June-quarter filings of seven companies say the constraint has moved. It is now about who sets the price — and on that question the past five quarters have already taught a lesson from which most readers drew the wrong conclusion.

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31 Jul
Latest News and Trends

Powerchip founder Frank Huang dies at 76; vice chair steps in as acting chief

  • July 31, 2026
  • By author-avatar jeff

Powerchip Semiconductor Manufacturing Corp. (PSMC, TWSE: 6770) said in a material-information filing on July 31 that its chairman, Frank Huang, died peacefully in his sleep at his home around midday that day of cardiopulmonary failure. He was 76.

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31 Jul
Latest News and Trends

ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

  • July 31, 2026
  • By author-avatar jeff

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure budget for a second time this year to a record US$10.5 billion, up from its original plan of US$8.5 billion.

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31 Jul
Latest News and Trends

Exclusive Interview: Helium shock threatens advanced chipmaking as Asia shifts dependence to the US

  • July 31, 2026
  • By author-avatar jeff

As geopolitical tensions in the Middle East continue to intensify, shifting export conditions and a broader realignment of supply from Qatar to the United States are reshaping global access to one of semiconductor manufacturing’s most fundamental materials: helium.

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Recent Posts
  • MediaTek 3Q26 revenue beats forecast, maintains peak-season momentum
    October 9, 2026 No Comments
  • GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
    October 9, 2026 No Comments
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