Yageo sees AI drive passive component demand
Yageo believes AI will fuel passive component demand, with operations improving further in the third quarter of 2024.
31
Jul
31
Jul
Teco and CSC join hands in entering Indian electric bus market
Teco Electric and Machinery (Teco) and China Steel Corporation (CSC) have partnered to supply EV components to India’s growing electric bus market.
31
Jul
SDC, LGD to advance OLEDoS microdisplay with tandem OLED technology
Samsung Display (SDC) and LG Display (LGD) are planning to incorporate their tandem OLED technology into OLEDoS (OLED on Silicon) solutions for next-generation micro OLED displays, aiming to widen their lead over Chinese competitors.
31
Jul
PTI gearing up for AI SoC boom with FOPLP
Backend house Powertech Technology (PTI), with its fan-out panel-level packaging (FOPLP) technology, is targeting AI SoC market potential, and expects AI-related revenue to account for 6% of the company’s sales in 2024.
31
Jul
Taiwan Fertilizer partners with global giants to lead ammonia energy shift
Taiwan Fertilizer Company (TFC) is accelerating its industrial transformation by forging new partnerships with major international firms from Japan and South Korea, focusing on ammonia energy collaborations.
31
Jul
Samsung earnings report surges in Q2 revenue and profits amid strong display sales
Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit of KRW10.44 trillion.
31
Jul
Micron starts shipping 9th-gen TLC NAND in SSDs
Micron Technology has announced that it is shipping ninth-generation (G9) TLC NAND in SSDs, making it the first in the industry to achieve this milestone.
31
Jul
Biden administration responds to packaging and testing industry as Amkor receives subsidies from CHIPS Act
The Biden Administration has announced that the CHIPS and Science Act will subsidize US$400 million to help Amkor, the largest semiconductor packaging and testing company in the US, build a new US$2 billion semiconductor packaging plant in Peoria, Arizona.
31
Jul
CyberLink embraces Generative AI to rival Adobe in content creation
At CyberLink’s Q2 earnings call, Chairman and CEO Jau Huang outlined the company’s strategy to integrate generative AI and AI PC technologies into its software suite. Huang acknowledged the immense pressure CyberLink has faced competing against Microsoft in the PC software domain, and identified Adobe as the key rival in the generative AI landscape.
31
Jul
Macronix expects NOR flash sales to return to growth in 2H24
Chipmaker Macronix International expects its NOR flash sales to return to a growth track in the second half of 2024, with a recovery in prices.